SprayCool® has a wide range of products and services providing solutions to your electronics thermal management needs in the Aerospace, Land, Sea, and High Performance Computing applications. With a focus on customer requirements, SprayCool invests heavily in the development of new technologies and standards which promote the delivery of state-of-the-art solutions and services for computing and high power electronics technology. SprayCool, the innovator and manufacturer of SprayCool products, is the leading provider of high performance electronic system cooling and packaging solutions that address the challenges facing military and commercial applications with a broad range of reliable and cost effective solutions.

SprayCool Technology
The main function of SprayCool Technology is to use evaporative cooling to keep processors (and other electronic components) in a thermally-controlled operating range, reducing power consumption, heat related failures, and allowing for higher density electronics packaging.  SprayCool is the process of using dielectric (non-conductive) liquid evaporation, or phase change, to cool electronic systems.  A fine mist of coolant is sprayed onto the electronic hot spots and immediately evaporates.  The vapor then circulates to a heat exchanger where it is condensed as the heat is rejected to air or a water system.  The cooling fluid is pumped to the SprayModule; in a continuous closed-loop fashion.  This process results in an extremely efficient method of cooling.

Beyond cooling electronics, SprayCool Technology provides many additional benefits:

• Energy savings due to increased cooling efficiency
• Reduced overall system size and weight
• Reduced air-conditioning and air-handling costs
• Protection of electronics from environmental hazards such as sand, dirt, and water
• Reduced noise levels
• Increased circuitry density
• Ability to upgrade to next generation of (hotter, denser) electronics without packaging modifications
• EMI and RFI shielding
• Self-cleaning sealed system with flexible service options

SprayCool Technology can be applied at the global level, where multiple printed circuit assemblies are housed in a sealed enclosure and misted with dielectric fluid, or at the chip level, where the SprayModule encapsulates only the processor (replacing the heat sink).  Both implementations are closed loop systems.

Modular Solution

 

Global Solution